Reliability of RFID tag inlay assembled by anisotropic conductive adhesive

Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC

Volumn , Issue , 2008, Pages 1203-1207

  An, Bing ^a   Wu, Yiping ^a   Cai, Xionghui ^a   Wu, Fengshun ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ALUMINA; ANTENNAS; CONDUCTIVE MATERIALS; DIES; EPOXY RESINS; FACINGS; FREQUENCY RESPONSE; MOBILE PHONES; RADIO NAVIGATION; RELIABILITY; RESINS; SILVER; TESTING; THERMOSETS;

ANISOTROPIC CONDUCTIVE ADHESIVES; ANTENNA TERMINALS; FAST PROCESSES; FLIP CHIPS; GOLD FILMS; HIGH FREQUENCIES; HUMIDITY TESTS; LOW COST MATERIALS; LOW COSTS; MAIN STREAMS; MASS PRODUCTIONS; MECHANICAL RELIABILITIES; PERIODIC VARIATIONS; PURE BENDS; RESISTANCE SHIFTS; RFID TAGS; WIND TESTS;

ADHESIVE JOINTS;

EID: 58149087346     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2008.4684524     Document Type: Conference Paper

References (4)

1. Wu Yiping, "RFID Tag Manufacturing," Global SMT & Packaging (Chinese Version), Vol.4, No.6, 2004, pp. 4-7. [In Chinese]
2. Y. Li and C. P. Wong, "Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: materials, processing, reliability, and applications," Mater. Sci. Eng. R, vol. 51, 2006 ,pp. 1-35.
3. S. Gillissen et.al. "Low temperature snap cure thermoset adhesives with good worklife," 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2005. 23-26 Oct. 2005. pp.166-170.
4. B. An, H. B. Chu, J. Q. He, J. Wang, L. Hua, F. S. Wu, Y. P. Wu. Low cost smart labels assembled by anisotropically conductive adhesive. 8th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06). Shanghai, China, JUN 27-30, 2006, pp55-58.