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Electrochimica Acta

Volumn 85, Issue , 2012, Pages 384-392

The influence of halides on the initial selective dissolution of Cu 3Au (1 1 1)

(6) Ankah, Genesis N a Pareek, Aparna a Cherevko, Serhiy a Topalov, Angel A a Rohwerder, Michael a Renner, Frank U a

a MAX PLANCK INSTITUT FÜR EISENFORSCHUNG GMBH (Germany)

Author keywords

Dealloying; Electrochemistry; Halide additives; Selective dissolution; Solid electrolyte interface

Indexed keywords

AFM; AU FILM; AU ISLANDS; AU SURFACES; AU(1 1 1 ); COPPER IODIDE; DEALLOYING; EX SITU; EX-SITU ATOMIC FORCE MICROSCOPY; HALIDE ADDITIVES; LENGTH SCALE; NANO-METER-SCALE; NANOPOROSITY; NEGATIVE SHIFT; POROUS SURFACE; SELECTIVE DISSOLUTION; SITU X-RAY DIFFRACTION; SOLID ELECTROLYTE INTERFACES; SULFURIC ACID SOLUTION; SURFACE POROSITY; ULTRA-THIN;

ATOMIC FORCE MICROSCOPY; BROMINE COMPOUNDS; CHLORINE COMPOUNDS; DISSOLUTION; ELECTROCHEMISTRY; SULFURIC ACID; X RAY DIFFRACTION;

GOLD;

EID: 84866989468 PISSN: 00134686 EISSN: None Source Type: Journal
DOI: 10.1016/j.electacta.2012.08.059 Document Type: Article

Times cited : (30)

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