A study of planar microvoiding in Pb-free solder joints

IPC - IPC Printed Circuits Expo, APEX and the Designers Summit 2007

Volumn 2, Issue , 2007, Pages 834-845

  Yau, Yung Herng ^a   Wengenroth, Karl ^a   Abys, Joseph ^a  

^a Enthone Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELERATING CRACKS; BATH CHEMISTRY; COMMON PROCESS; COPPER SUBSTRATES; DIFFERENT SIZES; IMMERSION SILVER; METALLIZATIONS; MICRO VOIDS; MICROVOID; MICROVOIDING; PB FREE SOLDERS; PCB ASSEMBLY; REFLOW PROCESS; RELIABILITY MARGIN; SECOND LEVEL; SILVER COATINGS; SOLDER JOINTS;

CAVES; COATINGS; COPPER; EXHIBITIONS; LEAD; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; SILVER PLATING; SUBSTRATES;

SOLDERING ALLOYS;

EID: 84866937966     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. R. Aspandiar, "Planar Microvoids", Intel Lead Free Symposium, Scottsdale, AZ, March 15-16, 2006
2. G. Arrigotti, "Planar Microvoids Intel Findings," IPC Committee 14-4 Meeting, February 9, 2006
3. Y-H. Yau et al., "Production Experience and Performance Characterization of a Novel Immersion Silver", IPC/APEX, Anaheim, CA, 2006
4. D. P. Cullen, "Characterization, Reproduction, and Resolution of Solder Joint Microvoiding", IPC/APEX, Anaheim, CA, 2005
5. S-P. Yu et al., "Optimal Reflow Profile for Lead-free Server Board and Failure Analysis of Solder Joint after Temperature Cyclic Test", TPCA Forum, Taipei, Taiwan, 2005
6. N-C. Lee, "How to Control Voiding in Reflow Soldering", Chip Scale Review, August-September 2005
7. Y-H. Yau et al., "The Chemistry and Properties of a Newly Developed Immersion Silver Coating for PWB", IPC/APEX, Anaheim, CA, 2004