Characterization, reproduction, and resolution of solder joint microvoiding

IPC - Electronic Circuits World Convention, Printed Circuits Expo, Apex, and the Designers Summit 2005, ECWC 10: The Perfect Fit

Volumn 2, Issue , 2005, Pages 1146-1161

  Cullen, Donald P ^a  

^a MacDermid Incorporated   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANALYTICAL EQUIPMENT; CIRCUIT DESIGNS; COPPER SURFACE; CROSS SECTIONAL AREA; ELECTROLESS NICKEL IMMERSION GOLD; FUNCTIONAL DEMANDS; GALVANIC EFFECT; IMMERSION SILVER; INDIVIDUAL SIZE; INTERFACIAL FRACTURE; INTERFACIAL VOIDS; MICRO VOIDS; MICROVOID; MICROVOIDING; PRIMARY FACTORS; PROCESS CHANGE; PROJECT TEAM; REFLOW TEMPERATURES; ROOT CAUSE; SOLDER JOINTS; SURFACE FINISHES;

DESIGN; EXHIBITIONS; POLYCHLORINATED BIPHENYLS; SOLDERING ALLOYS;

PRINTED CIRCUITS;

EID: 84869059656     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (29)

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