Production experience and performance characterization of a novel immersion silver

IPC - Printed Circuits Expo, Apex, and the Designers Summit 2006: Perfectly Cutting Edge

Volumn 2, Issue , 2006, Pages 816-823

  Yau, Y H ^a   Fan, C ^a   Guan, L ^a   Xiao, X ^a   Tam, R ^a   Wengenroth, K ^a   Abys, J ^a   Nagakura, M ^b   Sasaki, T ^b   Kiuchi, S ^b   Kumagai, H ^b   Toda, A ^b  

^a Enthone Inc   (United States)

^b Meltex Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BGA SOLDER JOINTS; IMMERSION SILVER; MICRO VOIDS; PB-FREE; PERFORMANCE CHARACTERIZATION; SOLDER MASK; SOLDER-JOINT STRENGTH;

CUTTING TOOLS; EXHIBITIONS; LEAD; PRINTED CIRCUITS; SILVER ALLOYS;

SOLDERING ALLOYS;

EID: 84867032693     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

1. F. van der Pas, "New Highest Reliable Generation of PWB Surface Finishes for Lead-Free Soldering and Future Applications", EIPC, Stockholm, June, 2005
2. Y-H. Yau et al., "The Chemistry and Properties of a Newly Developed Immersion Silver Coating for PWB", IPC/APEX, Anaheim, CA, 2004
3. Y-H. Yau et al., "The properties of Immersion Silver Coating for Printed Wiring Boards", IPC/APEX, Anaheim, CA, 2005
4. IPC-4553 Specification for Immersion Silver Plating for Printed Circuit Boards, 2005
5. M. G. Fontana and N. G. Greene, Corrosion Engineering, p 39, second edition, 1978, McGraw-Hill Book Company, NY, New York
6. R. Aspandiar, "Voids in Solder Joint", IPC/CCA PCB Assembly and Test Symposium, May 2005
7. D. P. Cullen, "Characterization, Reproduction, and Resolution of Solder Joint Microvoiding", IPC/APEX, Anaheim, CA, 2005
8. S-P. Yu et al., "Optimal Reflow Profile for Lead-free Server Board and Failure Analysis of Solder Joint after Temperature Cyclic Test", TPCA Forum, Taipei, Taiwan, 2005
9. N-C. Lee, "How to Control Voiding in Reflow Soldering", Chip Scale Review, August-September 2005