Study on a new type of conductive paste (2). Study on a conductive paste of silver-plated copper powder

Gongneng Cailiao/Journal of Functional Materials

Volumn 29, Issue 4, 1998, Pages 439-441

  Lu, Qinghua ^a   Hirai, Keizou ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BALL MILLING; COPPER POWDER; ELECTRIC CONDUCTIVITY; MECHANICAL ALLOYING; SILVER;

CONDUCTIVE PASTES;

CONDUCTIVE MATERIALS;

EID: 0032272779     PISSN: 10019731     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (4)