Reactive ion etching of polymer materials for an energy harvesting device

Microelectronic Engineering

Volumn 97, Issue , 2012, Pages 227-230

  Wang, Fei ^a   Bertelsen, Christian ^a   Skands, Gustav ^a   Pedersen, Thomas ^a   Hansen, Ole ^a  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

Author keywords

Energy harvesting; Polymer electret; Reactive ion etching; Wafer bonding

Indexed keywords

BONDING MATERIALS; COMPATIBLE POLYMERS; CORONA CHARGING; DEEP REACTIVE ION ETCHING; ENERGY HARVESTING DEVICE; ETCHING MASKS; HIGH SELECTIVITY; LOW TEMPERATURES; MASK MATERIALS; PHOTORESIST LAYERS; POLYMER MATERIALS; TARGET SURFACE; THERMO COMPRESSION BONDING; WAFER LEVEL;

ELECTRETS; ENERGY HARVESTING; PHOTORESISTS; REACTIVE ION ETCHING; SILICON WAFERS; WAFER BONDING;

POLYMERS;

EID: 84865459181     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2012.03.016     Document Type: Article

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