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Volumn 50, Issue 8, 2012, Pages 613-618
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Characteristics of low temperature SiN x films deposited by using highly diluted silane in nitrogen
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Author keywords
Conductivity resistivity; Dielectrics; Electrical properties; Highly diluted gas; Lowtemperature; PECVD; Silicon nitride; TFT; Vapor deposition
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Indexed keywords
BREAKDOWN FIELD;
CAPACITANCE VOLTAGE;
CURRENT-VOLTAGE MEASUREMENTS;
ELECTRICAL AND MECHANICAL PROPERTIES;
FIELD-EFFECT MOBILITIES;
FLAT-BAND VOLTAGE SHIFT;
LOW TEMPERATURES;
METAL INSULATORS;
ON/OFF RATIO;
SUBTHRESHOLD SLOPE;
TFT;
THIN-FILM TRANSISTOR (TFTS);
DIELECTRIC MATERIALS;
ELECTRIC PROPERTIES;
MECHANICAL PROPERTIES;
MIM DEVICES;
MIS DEVICES;
PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;
THIN FILM TRANSISTORS;
THRESHOLD VOLTAGE;
VAPOR DEPOSITION;
VAPORS;
SILICON NITRIDE;
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EID: 84865001835
PISSN: 17388228
EISSN: None
Source Type: Journal
DOI: 10.3365/KJMM.2012.50.8.613 Document Type: Article |
Times cited : (3)
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References (16)
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