Hybrid integration of LiNbO 3 thin films on micromachined Si substrates using room-temperature transfer bonding

Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012

Volumn , Issue , 2012, Pages 105-

  Takigawa, R ^a   Higurashi, E ^b   Suga, T ^a   Kawanishi, T ^c  

^a UNIVERSITY OF TOKYO   (Japan)

^b UNIVERSITY OF TOKYO   (Japan)

^c NATIONAL INSTITUTE OF INFORMATION AND COMMUNICATIONS TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP; HIGH QUALITY; HYBRID INTEGRATION; LITHIUM NIOBATE; MICRO-BUMPS; MICROMACHINED; ROOM TEMPERATURE; SI SUBSTRATES; SURFACE ACTIVATED BONDING; TRANSFER BONDING;

INTEGRATION; SILICON; TEMPERATURE; THIN FILMS; THREE DIMENSIONAL;

BONDING;

EID: 84864829348     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/LTB-3D.2012.6238064     Document Type: Conference Paper

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