An analytical study on diaphragm behavior for micro-machined capacitive pressure sensor

IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE

Volumn , Issue , 2002, Pages 505-510

  Soin, Norhayati ^a   Majlis, Burhanuddin Yeop ^a  

^a UNIVERSITI KEBANGSAAN MALAYSIA   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITIVE PRESSURE SENSORS; CORRUGATED DIAPHRAGM; DIFFERENT STRUCTURE; GEOMETRIC EFFECTS; MECHANICAL SENSORS; PLATE THEORIES; SMALL DEFLECTION; STRUCTURAL PARAMETER;

PARTIAL PRESSURE SENSORS; PRODUCT DESIGN;

DIAPHRAGMS;

EID: 84864684267     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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3. K. E. Peterson,"Silicon as a mechanical material", Proceedings of the IEEE pp.420-457 (May 1982)
4. X. Ding, W. Ko and J. Mansour,"Residual stress and mechanical properties of Boron Doped P+ - Silicon Films," Sensor and Actuators, A23 (1990)866.
5. + - Silicon Diaphragms," Transducers '91, Digest of Technical Papers, pp. 201.
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9. Bert, C.W. and Martindale, J.L, An Accurate, Simplified Method for Analyzing Thin Plates Undergoing Large Deflections, J.AIAA, vol. 26, n. 2,Feb. 1998, p.235.
10. Haringx, J. A, Design of Corrugated Diaphragms, ASME Transactions, vol. 79, 1957,p. 55.
11. Hin-Leung Chau and Wise, loc. Cit.
12. J. A. Ltyod,Phd theses.An Integrated Circuit Pressure Sensing System with Adaptive Linearity Calibration, Massachussets institute of Technology, Jun 1997