Engineering chain: A novel semiconductor engineering collaboration model

IEEE Transactions on Semiconductor Manufacturing

Volumn 25, Issue 3, 2012, Pages 394-407

  Cheng, Fan Tien ^a   Chen, Ying Liang ^a   Chang, Jonathan Yung Cheng ^b  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

Author keywords

Computer integrated manufacturing (CIM); design for manufacturing (DFM); engineering chain (EC); engineering chain management system (ECMS)

Indexed keywords

BUSINESS PROCESS; CHAIN MANAGEMENT; COLLABORATION MODELS; COMMUNICATION INTERFACE; COMPUTING TECHNOLOGY; CROSS INDUSTRY; CYCLE TIME; DESIGN CYCLE; DESIGN FOR MANUFACTURING; DESIGN HOUSE; ENABLING TECHNOLOGIES; FAILURE RATE; IC DESIGNS; INTEGRATED CIRCUIT DESIGNS; MASS PRODUCTION; OPERATING CONTROLS; SEMICONDUCTOR ENGINEERING; SEMICONDUCTOR MANUFACTURING;

COMPUTER INTEGRATED MANUFACTURING; MANAGEMENT; SEMICONDUCTOR DEVICE MANUFACTURE; TECHNOLOGY;

DESIGN;

EID: 84864675951     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/TSM.2012.2191626     Document Type: Article

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