Modelling of sputtering yield amplification in serial reactive magnetron co-sputtering

Surface and Coatings Technology

Volumn 206, Issue 24, 2012, Pages 5055-5059

  Kubart, T ^a   Schmidt, R M ^b   Austgen, M ^b   Nyberg, T ^a   Pflug, A ^c   Siemers, M ^c   Wuttig, M ^b   Berg, S ^a  

^a UPPSALA UNIVERSITY   (Sweden)

^b RWTH AACHEN UNIVERSITY   (Germany)

^c FRAUNHOFER INSTITUTE FOR SURFACE ENGINEERING AND THIN FILMS IST   (Germany)

Author keywords

Deposition rate; Magnetron sputtering; Oxide thin films; Reactive sputtering; Sputtering yield amplification; TRIDYN

Indexed keywords

BI-DOPING; BINARY COLLISION APPROXIMATIONS; CO-SPUTTERING TECHNIQUES; COSPUTTERING; HEAVY ELEMENTS; MAGNETRON CO-SPUTTERING; OXIDE THIN FILMS; REACTIVE DEPOSITION; REACTIVE MAGNETRON CO-SPUTTERING; REACTIVE SPUTTER DEPOSITION; SPUTTERING TARGET; SPUTTERING YIELDS; SURFACE BINDING ENERGIES; TARGET SURFACE; TRIDYN;

AMPLIFICATION; BINDING ENERGY; CHEMICAL ELEMENTS; DEPOSITION; DEPOSITION RATES; MAGNETRON SPUTTERING; REACTIVE SPUTTERING; THIN FILMS; VAPOR DEPOSITION;

SPUTTER DEPOSITION;

EID: 84864153008     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2012.06.005     Document Type: Article

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