Temperature effect on interfacial bonding property of single-carbon fiber/epoxy resin composite

Polymer Composites

Volumn 33, Issue 8, 2012, Pages 1368-1375

  Liu, H X ^a   Gu, Y Z ^a   Li, M ^a   Zhang, D M ^b   Li, Y X ^a   Zhang, Z G ^a  

^a BEIHANG UNIVERSITY   (China)

^b Beijing Aeronautical Science Technology Research Institute   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CF/EPOXY; CHAIN MOTIONS; CROSSLINK STRUCTURES; ELEVATED TEMPERATURE; FIBER COMPOSITE; INITIAL STAGES; INTERFACIAL BONDING; INTERFACIAL FRACTURE ENERGY; INTERFACIAL PROPERTY; INTERFACIAL THERMAL STABILITY; RESIN COMPOSITES; TEMPERATURE RISE;

CARBON FIBERS; DIFFERENTIAL SCANNING CALORIMETRY; EPOXY RESINS; FRACTURE ENERGY; HEAT RESISTANCE; RESINS; SPECIFIC HEAT; TEMPERATURE; THERMOGRAVIMETRIC ANALYSIS;

FIBERS;

EID: 84863982515     PISSN: 02728397     EISSN: 15480569     Source Type: Journal    
DOI: 10.1002/pc.22273     Document Type: Article

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