Multiscale simulation study on the curing reaction and the network structure in a typical epoxy system

Macromolecules

Volumn 44, Issue 21, 2011, Pages 8650-8660

  Liu, Hong ^a   Li, Min ^b   Lu, Zhong Yuan ^a   Zhang, Zuo Guang ^b   Sun, Chia Chung ^a   Cui, Tian ^a  

^a JILIN UNIVERSITY   (China)

^b BEIHANG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMISTIC MOLECULAR DYNAMICS SIMULATIONS; ATOMISTIC REPRESENTATION; COARSE-GRAINED; COARSE-GRAINED STRUCTURE; CROSS-LINKING PROCESS; CURING PROCESS; CURING REACTIONS; DISSIPATIVE PARTICLE DYNAMICS; EPOXY NETWORK; EPOXY RESIN SYSTEM; EPOXY SYSTEMS; MULTI-SCALE SIMULATION; NETWORK FORMATION; NETWORK STRUCTURES; REVERSE MAPPING;

COMPUTER SIMULATION; CURING; DYNAMICS; MECHANICAL PROPERTIES; MOLECULAR DYNAMICS; REACTION KINETICS; SYNTHETIC RESINS;

EPOXY RESINS;

EID: 80455173641     PISSN: 00249297     EISSN: None     Source Type: Journal    
DOI: 10.1021/ma201390k     Document Type: Article

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