Characterization of silver inkjet overlap-printing through cohesion and adhesion

Journal of Electrical Engineering and Technology

Volumn 7, Issue 1, 2012, Pages 91-96

  Lee, Sang Ho ^a   Cho, Young June ^a  

^a Korea Institute of Industrial Technology   (South Korea)

Author keywords

Adhesion; Cohesion; Droplet merging; Inkjet printing; Line bulging; Silver ink

Indexed keywords

ANALYTICAL APPROACH; COHESION; CONTACT ANGLE ANALYSIS; DROP-ON-DEMAND; HYDROPHILIZATION; INK DROPLETS; LINE BULGING; OPTICAL MICROSCOPES; SESSILE DROPS; SILICON SURFACES;

CONTACT ANGLE; DROPS; INK; INK JET PRINTING; INTERFACIAL ENERGY; MERGING; SILVER; SURFACE CHEMISTRY;

ADHESION;

EID: 84863288293     PISSN: 19750102     EISSN: None     Source Type: Journal    
DOI: 10.5370/JEET.2012.7.1.91     Document Type: Article

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