Optimization of wavelet-filtered in-situ plasma etch data using neural network and genetic algorithm

Materials and Manufacturing Processes

Volumn 26, Issue 3, 2011, Pages 398-402

  Kim, Byungwhan ^a   Kim, Daehyun ^a   Han, Dongil ^a   Lee, Nae Il ^b  

^a Sejong University   (South Korea)

^b Atto Co Ltd   (South Korea)

Author keywords

Genetic algorithm; Neural network model; Optical emission spectroscopy; Plasma etching; Wavelet

Indexed keywords

BACK PROPAGATION NEURAL NETWORKS; CONTINUOUS WAVELET; DATA VARIANCE; DISCRETE WAVELETS; ETCH PROFILE; ETCH RATES; IN-SITU; MODEL ERRORS; NEURAL NETWORK MODEL; NEW MODEL; NONUNIFORMITY; PLASMA ETCH; PLASMA ETCH PROCESS; WAVELET;

EMISSION SPECTROSCOPY; FORECASTING; LIGHT EMISSION; NEURAL NETWORKS; OPTICAL EMISSION SPECTROSCOPY; OPTIMIZATION; OXIDE FILMS; PLASMA ETCHING;

GENETIC ALGORITHMS;

EID: 84863182756     PISSN: 10426914     EISSN: 15322475     Source Type: Journal    
DOI: 10.1080/10426914.2010.520791     Document Type: Article

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