Microstructure and thermal conductivity of copper matrix composites reinforced with mixtures of diamond and SiC particles

Rare Metals

Volumn 31, Issue 1, 2012, Pages 58-63

  Han, Yuanyuan ^a   Guo, Hong ^a   Yin, Fazhang ^a   Zhang, Ximin ^a   Chu, Ke ^a   Fan, Yeming ^a  

^a GENERAL RESEARCH INSTITUTE FOR NONFERROUS METALS   (China)

Author keywords

Diamond hybrid SiC Cu composite; Differential effective medium; Microstructure; Thermal conductivity

Indexed keywords

COPPER MATRIX COMPOSITE; DIAMOND PARTICLES; DIFFERENTIAL EFFECTIVE MEDIUMS; PARTICLE VOLUME FRACTIONS; SIC PARTICLES; SIC/CU COMPOSITES; THEORETICAL CALCULATIONS; THEORETICAL MODELS; VOLUME RATIO;

DIAMONDS; METALLIC MATRIX COMPOSITES; MICROSTRUCTURE; PARTICLE REINFORCED COMPOSITES; SILICON CARBIDE;

THERMAL CONDUCTIVITY;

EID: 84863082768     PISSN: 10010521     EISSN: 18677185     Source Type: Journal    
DOI: 10.1007/s12598-012-0463-1     Document Type: Article

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