Direct growth of copper nanowires on a substrate for boiling applications

Micro and Nano Letters

Volumn 6, Issue 7, 2011, Pages 563-566

  Yao, Zhonghua ^a   Lu, Yen Wen ^b   Kandlikar, Satish G ^a  

^a ROCHESTER INSTITUTE OF TECHNOLOGY   (United States)

^b NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BOILING ENHANCEMENT; COPPER NANOWIRES; CU NANOWIRES; CU SUBSTRATE; DIFFERENT SUBSTRATES; DIRECT GROWTH; ELECTROCHEMICAL DEPOSITION; MECHANICAL RELIABILITY; METALLIC NANOWIRES; NANOWIRE STRUCTURES; POOL BOILING; POROUS ALUMINA MEMBRANES; PROCESS PARAMETERS;

ALUMINA; MECHANICAL PROPERTIES; PHASE TRANSITIONS; REDUCTION; SUBSTRATES; THERMODYNAMIC PROPERTIES;

NANOWIRES;

ALUMINUM OXIDE; COPPER; GOLD; NANOFILM; NANOMATERIAL; NANOWIRE; SILICON; SILVER;

CONFERENCE PAPER; ELECTROCHEMISTRY; HEAT TRANSFER; HIGH TEMPERATURE PROCEDURES; MECHANICS; MEMBRANE; NANOFABRICATION; NANOPORE; PARTICLE SIZE; POROSITY; RELIABILITY; ROOM TEMPERATURE; SCANNING PROBE MICROSCOPY; SURFACE PROPERTY; SYNTHESIS; THERMAL CONDUCTIVITY;

EID: 84862908040     PISSN: None     EISSN: 17500443     Source Type: Journal    
DOI: 10.1049/mnl.2011.0136     Document Type: Article

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