An RCP packaged transceiver chipset for automotive LRR and SRR systems in SiGe BiCMOS technology

IEEE Transactions on Microwave Theory and Techniques

Volumn 60, Issue 3 PART 2, 2012, Pages 778-794

  Trotta, Saverio ^a   Wintermantel, Markus ^b   Dixon, John ^c   Moeller, Ulrich ^b   Jammers, Richard ^a   Hauck, Torsten ^a   Samulak, Andrzej ^b   Dehlink, Bernhard ^a   Shun Meen, Kuo ^c   Li, Hao ^a   Ghazinour, Akbar ^a   Yin, Yi ^a   Pacheco, Sergio ^c   Reuter, Ralf ^a   Majied, Soran ^a   Moline, Daniel ^c   Aaron, Tang ^c   Trivedi, Vishal P ^c   Morgan, Dave J ^c   John, Jay ^c  

^a RF/IF Innovation Center   (Germany)

^b ADC Automotive Distance Control Systems GmbH   (Germany)

^c FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

Bipolar technology; high frequency; low noise; multichannel; package; receiver (Rx); redistributed chip package (RCP); SiGe; transceiver; transmitter (Tx)

Indexed keywords

BIPOLAR TECHNOLOGY; CHIP PACKAGES; HIGH FREQUENCY; LOW NOISE; MULTI-CHANNEL; PACKAGE; SIGE;

BICMOS TECHNOLOGY; MILLIMETER WAVES; OSCILLISTORS; SILICON ALLOYS; TRANSCEIVERS; TRANSMITTERS;

SEMICONDUCTING SILICON;

EID: 84862783999     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMTT.2011.2181536     Document Type: Article

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