Copper foam based vapor chamber for high heat flux dissipation

Experimental Thermal and Fluid Science

Volumn 40, Issue , 2012, Pages 93-102

  Ji, Xianbing ^a   Xu, Jinliang ^a   Abanda, Aime Marthial ^a  

^a NORTH CHINA ELECTRIC POWER UNIVERSITY   (China)

Author keywords

Capillary wick; Copper foam; Heat transfer; Vapor chamber

Indexed keywords

CAPILLARY WICK; CHARGE RATIO; COPPER FOAM; COPPER PLATE; HEATING POWER; HIGH HEAT FLUX; HIGH POROSITY; INCLINED ANGLE; MULTISCALES; NONUNIFORMITY; OPERATION RANGE; SURFACE TEMPERATURES; THERMAL PERFORMANCE; VAPOR CHAMBER; WORKING FLUID;

ACETONE; ATMOSPHERIC TEMPERATURE; COPPER; ETHANOL; EVAPORATORS; HEAT FLUX; HEAT RESISTANCE; HEAT TRANSFER; MIXED CONVECTION; SINTERING; SURFACE PROPERTIES;

WATER VAPOR;

EID: 84862776945     PISSN: 08941777     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.expthermflusci.2012.02.004     Document Type: Article

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