Film processing characteristics of nano gold suitable for conductive application on flexible substrates

Thin Solid Films

Volumn 520, Issue 17, 2012, Pages 5664-5670

  Gupta, Ashish ^a   Mandal, Saumen ^a   Katiyar, Monica ^a   Mohapatra, Yashowanta N ^a  

^a INDIAN INSTITUTE OF TECHNOLOGY KANPUR   (India)

Author keywords

Conductive ink; Flexible substrate; Gold nanoparticles; Printable electronics

Indexed keywords

ANNEALING TEMPERATURES; AU NANOPARTICLE; AVERAGE SIZE; CARBON-CHAIN LENGTH; CONDUCTIVE INK; DROP-CAST; ELECTRICAL CONDUCTIVITY; ELECTRICAL CONDUCTIVITY MEASUREMENTS; FILM PROCESSING; FLEXIBLE SUBSTRATE; GOLD FILM; GOLD NANOPARTICLE INK; GOLD NANOPARTICLES; NANO-GOLD; PEAK INTENSITY; PLASTIC SUBSTRATES; PRINTABLE ELECTRONICS; SINTERING TEMPERATURES; SPIN-COATED THIN FILMS; THIN GOLD FILM; XRD PEAKS;

ANNEALING; ATOMIC FORCE MICROSCOPY; BUTANE; CHAIN LENGTH; DIFFERENTIAL THERMAL ANALYSIS; ELECTRIC CONDUCTIVITY; FLEXIBLE ELECTRONICS; HEXANE; METAL NANOPARTICLES; METALLIC FILMS; OPTIMIZATION; POLYETHYLENE TEREPHTHALATES; SCANNING ELECTRON MICROSCOPY; SINTERING; SUBSTRATES; SYNTHESIS (CHEMICAL); THERMOGRAVIMETRIC ANALYSIS; THIN FILMS; X RAY DIFFRACTION;

GOLD;

EID: 84861806682     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2012.04.017     Document Type: Article

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