Liquid-filled metal microcapsules

ACS Applied Materials and Interfaces

Volumn 4, Issue 5, 2012, Pages 2406-2412

  Patchan, Marcia W ^a   Baird, Lance M ^a   Rhim, Yo Rhin ^a   LaBarre, Erin D ^a   Maisano, Adam J ^a   Deacon, Ryan M ^a   Xia, Zhiyong ^a   Benkoski, Jason J ^a  

^a JOHNS HOPKINS UNIVERSITY   (United States)

Author keywords

electroless plating; emulsion; interfacial polymerization; Microencapsulation

Indexed keywords

AQUEOUS PROCESSING; BARRIER PROPERTIES; DIISOCYANATES; INTERFACIAL POLYMERIZATION; METAL SHELL; MICROCAPSULES; MICROENCAPSULATION; MILD SYNTHESIS; NEAR ROOM TEMPERATURE; ORGANIC MOLECULES;

ELECTROLESS PLATING; EMULSIFICATION; EMULSIONS; ENCAPSULATION; LIQUIDS; MECHANICAL PROPERTIES; METALS; MOISTURE; PACKAGING; POLYMERIZATION;

SEALS;

EID: 84861429457     PISSN: 19448244     EISSN: 19448252     Source Type: Journal    
DOI: 10.1021/am201861j     Document Type: Article

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