Packaging technologies for 500°C SiC electronics and sensors

Materials Science Forum

Volumn 717-720, Issue , 2012, Pages 1033-1036

  Chen, Liang Yu ^a   Wayne Johnson, R ^b   Neudeck, Philip G ^a   Beheim, Glenn M ^a   Spry, David J ^a   Meredith, Roger D ^a   Hunter, Gary W ^a  

^a NASA GLENN RESEARCH CENTER   (United States)

^b AUBURN UNIVERSITY   (United States)

Author keywords

Electronics; High temperature; Packaging; Sensors; SiC

Indexed keywords

CAPACITIVE SENSORS; CERAMIC MATERIALS; ELECTRONIC EQUIPMENT; PACKAGING; SENSORS; SUBSTRATES; THICK FILMS;

CAPACITIVE PRESSURE SENSORS; CERAMIC SUBSTRATES; FILM METALLIZATION; HIGH TEMPERATURE; PACKAGING TECHNOLOGIES; SILICON CARBIDES (SIC);

SILICON CARBIDE;

EID: 84861384714     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/MSF.717-720.1033     Document Type: Conference Paper

References (10)

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