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Volumn 4, Issue 11, 2012, Pages 3444-3449
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Thermo-compressive transfer printing for facile alignment and robust device integration of nanowires
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Author keywords
[No Author keywords available]
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Indexed keywords
CONTROLLED ALIGNMENT;
ELECTRICAL AND MECHANICAL CONTACT;
ELECTRICAL CONTACT RESISTANCE;
ELECTRICAL DEVICES;
ELECTRONIC DEVICE;
INTERMEDIATE SUBSTRATES;
LOW MELTING TEMPERATURES;
LOW TEMPERATURES;
MECHANICAL ROBUSTNESS;
MECHANICALLY ROBUST;
METAL ELECTRODES;
MODERATE PRESSURES;
RELIABLE OPERATION;
ROBUST DEVICES;
SHEAR LOADINGS;
TARGET-SUBSTRATE;
TRANSFER PRINTING;
ALIGNMENT;
LOADING;
METALS;
NANOWIRES;
PRINTING;
ELECTRODES;
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EID: 84861378536
PISSN: 20403364
EISSN: 20403372
Source Type: Journal
DOI: 10.1039/c2nr30392b Document Type: Article |
Times cited : (6)
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References (29)
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