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Acta Materialia

Volumn 60, Issue 10, 2012, Pages 4107-4116

Thermal stability and strength of deformation microstructures in pure copper

(3) Saldana, C a King, A H b Chandrasekar, S c

a The Pennsylvania State University (United States)

b IOWA STATE UNIVERSITY (United States)

c SCHOOL OF INDUSTRIAL ENGINEERING (United States)

Author keywords

Deformation twinning; Nanocrystalline Cu; Severe plastic deformation; Ultrafine grained (UFG) microstructure

Indexed keywords

DEFORMATION MICROSTRUCTURE; DEFORMATION PARAMETER; DEFORMATION TWINNING; MULTICOMPONENTS; NANOCRYSTALLINE CU; PURE COPPER; SEVERE PLASTIC DEFORMATIONS; ULTRA FINE GRAINED MICROSTRUCTURE; ULTRAFINE-GRAINED;

COPPER; MICROSTRUCTURE; PLASTIC DEFORMATION;

TWINNING;

EID: 84861163364 PISSN: 13596454 EISSN: None Source Type: Journal
DOI: 10.1016/j.actamat.2012.04.022 Document Type: Article

Times cited : (45)

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