Low temperature packaging of BioMEMS and Lab-on-chip devices

2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011

Volumn , Issue , 2011, Pages 562-566

  Matthias, Thorsten ^a   Miller, Ron ^b   Thanner, Christine ^a   Burgstaller, Daniel ^a   Kreindl, Gerald ^a   Dragoi, Viorel ^a   Kettner, Paul ^a   Lindner, Paul ^a  

^a EV GROUP   (Austria)

^b EV Group Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHRONIC DISEASE; INFECTIOUS DISEASE; LAB-ON-CHIP DEVICES; LOW TEMPERATURES; MICRO-MANUFACTURING; PARALLELIZATIONS; POINT-OF-CARE DIAGNOSTICS;

DEVELOPING COUNTRIES; ELECTRONICS PACKAGING; HEALTH CARE;

BIOMEMS;

EID: 84860910361     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2011.6184484     Document Type: Conference Paper

References (7)

1. Yole Developpement, Microfluidic substrates and processing trends, Report 2011
2. T. Barbuzzi, MEMS based microfluidic system for molecular diagnostics, Proc. Semicon Singapore 2011
3. V. Loryuenyong, T. Sands, N. Cheung, "Photo-Polymer Wafer Bonding for Double Layer Transfer", Mat. Res. Soc. Symp. Proc. Vol. 768, G5.6.1
4. Sheng Li, Carl B Freidhoff, Robert M Younga, Reza Ghodssi, "Fabrication of micronozzles using low-temperature wafer-level bonding with SU-8", J. Micromech. Microeng. 13 (2003) 732-738
5. P. Svasek, E. Svasek, B. Lendl, M. Vellekoop, "Fabrication of miniaturized fluidic devices using SU-8 based lithography and low temperature wafer bonding", Sensors and Actuators A 115 (2004) 591-599
6. C. Brubaker, M. Wimplinger, P. Lindner, S. Pargfrieder, "Investigating the Use of Spray-Coating Technology in MEMS Applications" Micro Magazine, March, 2004; pp 45
7. D. Johnson, H. Miller, A. Bhandare, J. Molea, H. Luesebrink, S. Pargfrieder, T. Matthias, G. Mittendorfer, "Direct lamination of SU-8 cavities over MEMS components", Proc. MEMS Industry Forum, Semicon Europe 2006