Experimental investigation of microgap cooling technology for minimizing temperature gradient and mitigating hotspots in electronic devices

2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011

Volumn , Issue , 2011, Pages 530-535

  Alam, Tamanna ^a   Lee, Poh Seng ^a   Yap, Christopher R ^a   Jin, Liwen ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

AVERAGE VALUES; COOLING TECHNOLOGY; ELECTRONIC DEVICE; EXPERIMENTAL INVESTIGATIONS; FLUX CONDITIONS; HEATED SURFACES; HIGH-PERFORMANCE COMPUTING TECHNOLOGY; HOT SPOT; HOTSPOTS; LOCAL HEAT; MAXIMUM TEMPERATURE; MICRO GAPS; MILITARY SYSTEMS; PACKAGING DENSITY; PEAK TEMPERATURES; SILICON-BASED; THIN FILM EVAPORATION; TWO PHASE; WALL TEMPERATURES;

CHIP SCALE PACKAGES; COOLING; HEAT FLUX; PHASE TRANSITIONS; THERMAL GRADIENTS; THERMOELECTRIC EQUIPMENT;

TECHNOLOGY;

EID: 84860894303     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2011.6184478     Document Type: Conference Paper

References (6)

1. Lee J., Mudawar I., "Low-temperature two-phase microchannel cooling for high-heat-flux, Thermal Management of Defense Electronics," IEEE Transactions on Components and Packaging Technologies, Vol. 32, No. 2 (2009), pp. 453-465.
2. Pokharna H., Masahiro K., DiStefanio E., Mongia R., Crowley B. J., Chen W., Izenson M., "Microchannel cooling in computing platforms: performance needs and challenges in implementation," Second International Conference on Microchannels and Minichannels, ICMM, 2004, pp. 109-118.
3. Koo J., Jiang L., Bari A., Zhang L., Wang E., Kenny T. W., Santiago J. G., Goodson K. E., "Convective boiling in microchannel heat sinks with spatiallyvarying heat generation," Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm, 2002, pp. 341-346.
4. Cho E.S., Koa J.-M., Jiang L., Prasher R. S., Kim M. S., Santiago J. G., Kenny T. W., and Goodson K. E., "Experimental study on two-phase heat transfer in microchannel heat sinks with hotspots,"Semiconductor Thermal Measurement and Management Symposium, 2003, pp. 242-246.
5. Bar-Cohen A. and Rahim E., "Modeling and prediction of two-phase refrigerant flow regimes and heat transfer characteristics in microgap channel,"Heat Transfer Engineering, Vol. 30, No. 8 (2009), pp. 601-625.
6. Consolini L., Thome J.R., "Micro-channel flow boiling heat transfer of R-134a, R-236fa, and R-245fa," Microfluid Nanofluid, Vol. 6 (2009), pp. 731-746.