Microchannel cooling in computing platforms: Performance needs and challenges in implementation

Proceedings of the Second International Conference on Microchannels and Minichannels (ICMM2004)

Volumn , Issue , 2004, Pages 109-118

  Pokharna, Himanshu ^a   Masahiro, Kuroda ^a   DiStefano, Eric ^a   Mongia, Rajiv ^a   Barry, Jim ^b   Crowley, Chris ^b   Chen, Weibo ^b   Izenson, Mike ^b  

^a INTEL CORPORATION   (United States)

^b CREARE INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EVAPORATORS; HEAT EXCHANGERS; HEAT RESISTANCE; HEAT SINKS; HEAT TRANSFER COEFFICIENTS; MICROPROCESSOR CHIPS; TWO PHASE FLOW;

COMPUTING PLATFORMS; FLUID RESISTANCE; MICROCHANNEL COOLING;

COOLING;

EID: 4544248638     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/icmm2004-2325     Document Type: Conference Paper

References (4)

1. Bird, R.B., Stewart, W.E. and Lightfoot, E.N.; Transport Phenomena, Section 13, John Wiley & Sons, New York, NY, 1960.
2. Kandlikar, S. G., "Heat Transfer Mechanisms During Flow Boiling in Microchannels," First International Conference on Microchannels and Minichannels, 2003, pp. 33-46.
3. Qu, W. and Mudawar, I., "Thermal Design Methodology for High-Heat-Flux Single-Phase and Two-Phase Micro-Channel Heat Sinks," 2002 Inter Society Conference on Thermal Phenomena, IEEE, 2002, pp. 347-359.
4. Rohsenow, W.M., Hartnett, J.P. and Cho, Y.I.; Handbook of Heat Transfer; 3rd Edition, Section 5, McGraw-Hill, New York, NY, 1998.