High-speed laser plating on Cu leadframe using Ag nanoparticles

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 440-446

  Maekawa, Katsuhiro ^a   Yamasaki, Kazuhiko ^a   Niizeki, Tomotake ^a   Mita, Mamoru ^b   Matsuba, Yorishige ^c   Terada, Nobuto ^c   Saito, Hiroshi ^c  

^a IBARAKI UNIVERSITY   (Japan)

^b Mita Engineering Office   (Japan)

^c Harima Chemicals Inc   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AG NANOPARTICLE; DROP-ON-DEMAND; EXPERIMENTAL SETUP; HIGH-SPEED; LEAD-FRAME; MATERIAL CONSUMPTION; MULTI-STEP; PLATING PARAMETERS; PLATING PROCESS; POST PROCESSING; SINTERED FILMS; SINTERING TIME; THERMAL DAMAGE; WIRE BONDABILITY; WIREBONDING;

GOLD; NANOPARTICLES; PHOTORESISTS; PLATING; SINTERING; SURFACE ROUGHNESS; WIRE;

SILVER;

EID: 77955208185     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490933     Document Type: Conference Paper

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