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Volumn 40, Issue 1, 2009, Pages 202-205
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Ultra-thin chip packaging (UTCP): A promising technology for future flexible display interconnection
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Author keywords
[No Author keywords available]
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Indexed keywords
CHIP SCALE PACKAGES;
INTEGRATED CIRCUIT INTERCONNECTS;
DISPLAY TECHNOLOGIES;
DRIVER ELECTRONICS;
FLEXIBLE DISPLAY SYSTEMS;
INTERCONNECTION TECHNOLOGY;
ULTRA-THIN CHIPS;
FLEXIBLE DISPLAYS;
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EID: 84860733969
PISSN: 0097966X
EISSN: 21680159
Source Type: Conference Proceeding
DOI: 10.1889/1.3256741 Document Type: Conference Paper |
Times cited : (3)
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References (9)
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