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Volumn 40, Issue 1, 2009, Pages 202-205

Ultra-thin chip packaging (UTCP): A promising technology for future flexible display interconnection

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84860733969     PISSN: 0097966X     EISSN: 21680159     Source Type: Conference Proceeding    
DOI: 10.1889/1.3256741     Document Type: Conference Paper
Times cited : (3)

References (9)
  • 6
    • 85072739671 scopus 로고    scopus 로고
    • FlexiDis Newsletter no. 3 (downloadable from
    • I. French, “EPLaR and FlexiDis”, FlexiDis Newsletter no. 3 (downloadable from http://www.flexidis-project.org), 6, (2007).
    • (2007) Eplar and FlexiDis” , vol.6
    • French, I.1
  • 9
    • 85072722854 scopus 로고    scopus 로고
    • TI Instruments, http://www.ti.com.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.