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Volumn 16, Issue 7, 2008, Pages 765-775

Interconnecting drivers to flexible displays

Author keywords

Driver bonding; Flexible display interconnection

Indexed keywords

AUTOMOBILE DRIVERS; POLYETHYLENE TEREPHTHALATES; POLYIMIDES; POLYMERS; POSITRON EMISSION TOMOGRAPHY; STAINLESS STEEL; TESTING; THERMOPLASTICS;

EID: 54149110931     PISSN: 10710922     EISSN: None     Source Type: Journal    
DOI: 10.1889/1.2953484     Document Type: Conference Paper
Times cited : (3)

References (7)
  • 1
    • 54149105459 scopus 로고    scopus 로고
    • http://www.hitachichem.co.jp/english/products/do/index.html.
  • 2
    • 54149094382 scopus 로고    scopus 로고
    • http://www.plasticlogic.com/.
  • 3
    • 54149104346 scopus 로고    scopus 로고
    • B. Vandecasteele, J. Maattanen, T. Podprocky, and J. Vanfleteren, Low temperature flip chip attachment for flexible display applications, Proc Intl. Conf. Electronics Packaging, 307312 (2004).
    • B. Vandecasteele, J. Maattanen, T. Podprocky, and J. Vanfleteren, "Low temperature flip chip attachment for flexible display applications," Proc Intl. Conf. Electronics Packaging, 307312 (2004).
  • 4
    • 54149100036 scopus 로고    scopus 로고
    • MilStd883, Method 2019.7: Die shear strength, March 7th, 2003.
    • MilStd883, Method 2019.7: Die shear strength, March 7th, 2003.
  • 5
    • 54149111036 scopus 로고    scopus 로고
    • http://www.st.com.
  • 6
    • 0033352029 scopus 로고    scopus 로고
    • The contact resistance and reliability of anisotropically conductive film (ACF)
    • May
    • M. J. Yim and K. W. Paik, "The contact resistance and reliability of anisotropically conductive film (ACF)," IEEE Trans. Advanced Packaging 22, No. 2 (May, 1999).
    • (1999) IEEE Trans. Advanced Packaging , vol.22 , Issue.2
    • Yim, M.J.1    Paik, K.W.2
  • 7
    • 54149105845 scopus 로고    scopus 로고
    • http://wwwleti.cea.fr.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.