Enhanced thermal conductivity and thermal performance of form-stable composite phase change materials by using β-Aluminum nitride

Applied Energy

Volumn 86, Issue 7-8, 2009, Pages 1196-1200

  Wang, Weilong ^a,b   Yang, Xiaoxi ^c   Fang, Yutang ^a   Ding, Jing ^d   Yan, Jinyue ^b,e  

^a SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

^b MÄLARDALEN UNIVERSITY   (Sweden)

^c DONGGUAN UNIVERSITY OF TECHNOLOGY   (China)

^d SUN YAT SEN UNIVERSITY   (China)

^e ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

Polyethylene glycol; Silica gel; Thermal conductivity; Aluminum nitride

Indexed keywords

ALUMINUM; ALUMINUM NITRIDE; BLENDING; HEAT STORAGE; NITRIDES; POLYETHYLENE GLYCOLS; POLYETHYLENES; SILICA; SILICA GEL; THERMAL CONDUCTIVITY; THERMOANALYSIS;

ENHANCED THERMAL CONDUCTIVITY; FORM STABLE PHASE CHANGE MATERIAL; FORM-STABLE COMPOSITE PHASE CHANGE MATERIALS; HIGH CONDUCTIVITY; RELEASE PERFORMANCE; THERMAL ANALYZERS; THERMAL PERFORMANCE; TRANSIENT PLANE SOURCE TECHNIQUES;

PHASE CHANGE MATERIALS;

ALUMINUM COMPOUND; COMPOSITE; MELTING; STORAGE; THERMAL CONDUCTIVITY;

EID: 61849180914     PISSN: 03062619     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apenergy.2008.10.020     Document Type: Article

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