Silicon-embedded 3D toroidal air-core inductor with through-wafer interconnect for on-chip integration

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2012, Pages 325-328

  Yu, Xuehong ^a   Kim, Minsoo ^a   Herrault, Florian ^a   Ji, Chang Hyeon ^a   Kim, Jungkwun ^a   Allen, Mark G ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3D STRUCTURE; AIR CORE INDUCTORS; CMOS COMPATIBLE; DC RESISTANCE; EMBEDDING STRUCTURE; HIGH-POWER; KEY TECHNIQUES; ON-CHIP INTEGRATION; QUALITY FACTORS; SILICON SUBSTRATES; SILICON TRENCH; TOROIDAL INDUCTORS; WAFER ETCHING; WAFER SURFACE;

FABRICATION; MEMS; THREE DIMENSIONAL;

SILICON WAFERS;

EID: 84860490360     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2012.6170201     Document Type: Conference Paper

References (9)

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