Heat removal and thermophysical properties of biporous evaporators

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Volumn , Issue , 2006, Pages

  Semenic, Tadej ^a   Catton, Ivan ^a  

^a Engineering IV   (United States)

Author keywords

Biporous evaporator; High power electronics cooling

Indexed keywords

CAPILLARITY; CLUSTER ANALYSIS; HEAT FLUX; PORE SIZE; POWER ELECTRONICS; SIZE DISTRIBUTION; THERMODYNAMIC PROPERTIES; VAPORS;

BIPOROUS EVAPORATORS; ELECTRONIC DEVICES; HIGH-POWER ELECTRONICS COOLING; PARTICLE DIAMETERS;

EVAPORATORS;

EID: 85196524272     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2006-15928     Document Type: Conference Paper

References (9)

1. Advanced Cooling Technologies, Inc., www.1-act.com
2. Cao X., L., Cheng, P., Zhao, T., S., 2002, "Experimental Study of Evaporative Heat Transfer in Sintered Copper Bidispersed Wick Structures," Journal of Thermophysics and Heat Transfer, Vol. 16, No.4, pp. 547-552.
3. Konev, S.V., Polasek, F., Horvat, L., 1987, "Investigation of Boiling in Capillary Structures," Heat Transfer-Soviet Research, Vol.19, No.1, pp.14-17.
4. th International Heat Pipe Conference, Albuquerque, NM, May 1-5.
5. North, M.T., 2000, personal communication.
6. Semenic, T, Lin, Y.Y., Catton, I, 2005a, "Use of Liquid Film Evaporation in Biporous Media to Achieve High Heat Flux over Large Areas," Proc. of ASME 2005 Summer Heat Transfer Conference, Paper No. HT2005-72239.
7. th Minsk International Seminar "Heat Pipes, Heat Pumps, Refrigerators", Vol.2, pp. 47-51.
8. Semenic, T, Lin, Y.Y., Catton, I., 2005c, "Biporous Sintered Copper for Closed Loop Heat Pipe Evaporator," Proc. of IMECE2005, Paper No. IMECE2005-82180.
9. th International Heat Pipe Conference, Vol. 1, pp.127-135.