Boiling Incipience and Nucleate Boiling Heat Transfer of Highly Wetting Dielectric Fluids From Electronic Materials

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 13, Issue 4, 1990, Pages 1032-1039

  You, Seung Mun ^a   Bar Cohen, Avram ^a   Simon, Terry W ^a  

^a UNIVERSITY OF MINNESOTA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC EQUIPMENT--COOLING; MICROELECTRONICS--COOLING;

BOILING INCIPIENCE; ELECTRONIC MATERIALS; NUCLEATE BOILING HEAT TRANSFER; POOL BOILING; WETTING DIELECTRIC FLUIDS;

HEAT TRANSFER;

EID: 0025538460     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/33.62545     Document Type: Article

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