Electrochemical behavior of B30 Cu-Ni alloy with super-hydrophobic surface in 3.5%NaCl solution

Jinshu Xuebao/Acta Metallurgica Sinica

Volumn 48, Issue 1, 2012, Pages 94-98

  Xu, Qunjie ^a   Deng, Xianqin ^a   Pan, Hongtao ^a   Yun, Hong ^a  

^a SHANGHAI UNIVERSITY OF ELECTRIC POWER   (China)

Author keywords

Chemical etching; Corrosion resistance; Cu Ni alloy; Self assembly; Super hydrophobic film

Indexed keywords

3.5%NACL; ANTI-CORROSION; CHEMICAL ETCHING; CU-NI ALLOYS; ELECTROCHEMICAL BEHAVIORS; ELECTROCHEMICAL TEST; ETCHING PROCESS; EXCELLENT CORROSION RESISTANCES; INHIBITION EFFICIENCY; SELF-ASSEMBLY TECHNOLOGY; SUPER-HYDROPHOBIC SURFACES; SUPERHYDROPHOBIC;

CONTACT ANGLE; COPPER; CORROSION RESISTANCE; ETCHING; SELF ASSEMBLY; SODIUM CHLORIDE; SURFACE CHEMISTRY; SURFACE ROUGHNESS;

HYDROPHOBICITY;

EID: 84860309239     PISSN: 04121961     EISSN: None     Source Type: Journal    
DOI: 10.3724/SP.J.1037.2011.00470     Document Type: Article

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