Photoelectrochemical study of the corrosion and inhibition on Cu

Jinshu Xuebao/ Acta Metallurgica Sinica

Volumn 44, Issue 11, 2008, Pages 1360-1365

  Xu, Qunjie ^a   Zhu, Lujun ^a,b   Qi, Hang ^a   Cao, Weimin ^b   Zhou, Guoding ^a  

^a SHANGHAI UNIVERSITY OF ELECTRIC POWER   (China)

^b SHANGHAI UNIVERSITY   (China)

Author keywords

Corrosion; Cu; Inhibitor; Photoelectrochemistry; Poly aspartic

Indexed keywords

ADSORPTION; BORATE MINERALS; CORROSION; CORROSION INHIBITORS; DOPING (ADDITIVES); ELECTROCHEMISTRY; SODIUM ALLOYS; SODIUM CHLORIDE;

BUFFER SOLUTIONS; COMPETITIVE ADSORPTIONS; CORROSION BEHAVIORS; CU; CU ELECTRODES; INHIBITOR; PHOTO RESPONSES; PHOTOELECTROCHEMICAL; PHOTOELECTROCHEMICAL METHODS; PHOTOELECTROCHEMISTRY; POLY-ASPARTIC; SCHOTTKY; SEMI-CONDUCTORS; TEST RESULTS;

COPPER;

EID: 57749112001     PISSN: 04121961     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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