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Volumn 14, Issue 1, 2011, Pages 12-17

Effect of thermal cycling on microtensile bond strengths of various adhesives to dentin

Author keywords

Adhesive; Microtensile bond strength; Thermal cycling

Indexed keywords


EID: 84859568515     PISSN: None     EISSN: 21462852     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (1)

References (18)
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.