Transfer-printed microscale integrated circuits for high performance display backplanes

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 1, Issue 12, 2011, Pages 1916-1922

  Bower, Christopher A ^a   Menard, Etienne ^a   Bonafede, Salvatore ^a   Hamer, John W ^b   Cok, Ronald S ^b  

^a SEMPRIUS INC   (United States)

^b EASTMAN KODAK COMPANY   (United States)

Author keywords

Assembly; backplanes; displays; OLEDs; printed electronics; transfer printing

Indexed keywords

ACTIVE MATRIX ORGANIC LIGHT EMITTING DIODES; BACKPLANES; DISPLAY BACKPLANES; GLASS SUBSTRATES; HIGH YIELD; LUMINANCE UNIFORMITY; METALLIZATION PROCESS; MICRO-SCALES; OLED DISPLAYS; OLEDS; POSITIONAL ACCURACY; PRINTED ELECTRONICS; SEMICONDUCTOR FOUNDRIES; SILICON INTEGRATED CIRCUITS; SWITCHING SPEED; THIN FILM TRANSISTORS (TFT); TRANSFER-PRINTING;

ASSEMBLY; DISPLAY DEVICES; INTEGRATED CIRCUITS; LUMINANCE; PIXELS; PRINTING; SILICON WAFERS; SUBSTRATES; THIN FILM TRANSISTORS;

LIGHT EMITTING DIODES;

EID: 84859051410     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2011.2128324     Document Type: Conference Paper

References (8)

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