Transfer-printed microscale integrated circuits

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 618-623

  Bower, C A ^a   Menard, E ^a   Bonafede, S ^a   Burroughs, S ^a  

^a SEMPRIUS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BURIED OXIDES; CHIP PLACEMENT; CMOS PROCESSS; DEVICE LAYERS; DISCRETE DEVICES; ELASTOMERIC STAMPS; EMERGING TECHNOLOGIES; INTER-LAYER DIELECTRICS; IV CHARACTERISTICS; MICRO-SCALES; MICROFABRICATED; PLACEMENT ACCURACY; PRINT OPERATIONS; SACRIFICIAL LAYER; SILICON CHIP; SILICON-BRIDGE; TARGET-SUBSTRATE;

ALUMINA; CMOS INTEGRATED CIRCUITS; INTEGRATED CIRCUITS; MOS CAPACITORS; PRINTING; SEMICONDUCTING SILICON COMPOUNDS; SUBSTRATES; SURFACE TOPOGRAPHY;

SILICON WAFERS;

EID: 70349653042     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074077     Document Type: Conference Paper

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