Design of complex structured monolithic heat sinks for enhanced air cooling

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 2, Issue 2, 2012, Pages 266-277

  Krishnan, Shankar ^a   Hernon, Domhnaill ^b   Hodes, Marc ^c   Mullins, John ^d   Lyons, Alan M ^e  

^a PACIFIC NORTHWEST NATIONAL LABORATORY   (United States)

^b LUCENT TECHNOLOGIES   (United States)

^c Tufts University   (United States)

^d Aerogen Ltd   (Ireland)

^e CITY UNIVERSITY OF NEW YORK   (United States)

Author keywords

Convective heat sinks; Convective heat transfer; electronics cooling

Indexed keywords

2D-ARRAYS; 3-D PRINTING; AIR COOLING; ANALYTICAL SOLUTIONS; COMPLEX STRUCTURE; CONVECTIVE HEAT; CONVECTIVE HEAT TRANSFER; COPPER STRUCTURES; DIRECT SIMULATION; ELECTRONICS COOLING; EXPERIMENTAL VALIDATIONS; FLOWTHROUGH; HEAT TRANSPORT; HYDRODYNAMIC INSTABILITIES; LOCAL MIXING; PARALLEL PLATES; PERFORMANCE ENHANCEMENTS; PHYSICAL MECHANISM; PLASTIC PATTERNS; PUMPING POWER;

DESIGN; ELECTRONIC COOLING; INVESTMENT CASTING; PLATES (STRUCTURAL COMPONENTS); PRESSURE DROP;

HEAT SINKS;

EID: 84859040750     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2011.2175448     Document Type: Article

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