Controlling E. coli adhesion on high-k dielectric bioceramics films using poly(amino acid) multilayers

Langmuir

Volumn 28, Issue 9, 2012, Pages 4301-4308

  Lawrence, Neil J ^a   Wells Kingsbury, Jamie M ^a   Ihrig, Marcella M ^a   Fangman, Teresa E ^a   Namavar, Fereydoon ^b   Cheung, Chin Li ^a  

^a UNIVERSITY OF NEBRASKA LINCOLN   (United States)

^b UNIVERSITY OF NEBRASKA MEDICAL CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION BEHAVIORS; BACTERIAL ADHESION; BIOCERAMIC FILM; DIELECTRIC STRENGTHS; E. COLI; ESCHERICHIA COLI (E. COLI); FUNCTIONALIZATIONS; FUNCTIONALIZED; GLASS SLIDES; GLASS SURFACES; HIGH-K DIELECTRIC; L-ARGININE; L-ASPARTIC ACID; LAYER BY LAYER DEPOSITION; MICRO PATTERNING; MULTI-LAYER-COATING; MULTIPLE LAYERS; POLY(AMINO ACID)S; POSITIVELY CHARGED; SURFACE COVERAGES; WILD-TYPE STRAIN;

ADHESION; BACTERIA; BIOCERAMICS; COATINGS; DEPOSITION; ESCHERICHIA COLI; FILM PREPARATION; GLASS; MULTILAYER FILMS; MULTILAYERS; SURFACES; TANTALUM OXIDES; ZIRCONIA;

AMINO ACIDS;

AMINO ACID; POLYMER;

ARTICLE; ARTIFICIAL MEMBRANE; BACTERIUM ADHERENCE; CHEMISTRY; ESCHERICHIA COLI; PHYSIOLOGY;

AMINO ACIDS; BACTERIAL ADHESION; ESCHERICHIA COLI; MEMBRANES, ARTIFICIAL; POLYMERS;

EID: 84857829631     PISSN: 07437463     EISSN: 15205827     Source Type: Journal    
DOI: 10.1021/la2033725     Document Type: Article

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