A liquid-based system for CPU cooling implementing a jet array impingement waterblock and a tube array remote heat exchanger

Applied Thermal Engineering

Volumn 39, Issue , 2012, Pages 86-94

  Whelan, B P ^a   Kempers, R ^a,b   Robinson, A J ^a  

^a TRINITY COLLEGE DUBLIN   (Ireland)

^b NOKIA RESEARCH CENTER   (United States)

Author keywords

CPU thermal management; Electronics cooling; Liquid jet impingement; Waterblock

Indexed keywords

COOLING CAPACITY; CPU COOLING; ELECTRONICS COOLING; HARDWARE COMPONENTS; HYDRAULIC POWER; INJECTION MOLDING TECHNIQUES; INTEGRATED HEAT; JET ARRAYS; LIQUID JET IMPINGEMENT; LOW COSTS; MAXIMUM POWER; OVERALL THERMAL RESISTANCE; PENTIUM; POWER LOADING; SURFACE AREA; SYSTEM COSTS; TEMPERATURE DIFFERENCES; TUBE ARRAYS; TUBE BUNDLE; TYPICAL DESIGN; VOLUMETRIC FLOW RATE; WATERBLOCK;

ELECTRONIC COOLING; HEAT EXCHANGERS; INJECTION MOLDING; JETS; TUBES (COMPONENTS);

LIQUIDS;

EID: 84856802743     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.applthermaleng.2012.01.013     Document Type: Article

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