Synthesis and properties of trifluoromethyl groups containing epoxy resins cured with amine for low D k materials

Journal of Applied Polymer Science

Volumn 124, Issue 3, 2012, Pages 2615-2624

  Wang, J Y ^a   Yang, S Y ^a   Huang, Y L ^a   Tien, H W ^a   Chin, W K ^a   Ma, C C M ^a   Shu, W J ^b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b TA HWA INSTITUTE OF TECHNOLOGY   (Taiwan)

Author keywords

dielectric constants; epoxy resins; free volume; thermal behaviors

Indexed keywords

CURED EPOXY RESINS; CURING AGENTS; DGEBA EPOXY RESINS; DIELECTRIC CONSTANTS; DIGLYCIDYL ETHER OF BISPHENOL; DIGLYCIDYL ETHER OF BISPHENOL-A; ENVIRONMENTAL-FRIENDLY; FLUORINE ATOMS; MODIFIED EPOXY; MOISTURE ABSORPTION; RESIN STRUCTURES; STRUCTURE AND PHYSICAL PROPERTIES; THERMAL BEHAVIORS; THERMAL DECOMPOSITION TEMPERATURE; TRIFLUOROMETHYL; TRIFLUOROMETHYL GROUP; WEIGHT LOSS;

CONTACT ANGLE; CURING; ETHERS; FLUORINE; FREE VOLUME; METHANE; PHENOLS; PYROLYSIS; RESINS;

EPOXY RESINS;

EID: 84856711416     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.35300     Document Type: Article

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