Effect of bath temperature on corrosion resistance and structure of Cu-Ni alloy electrodeposited by brush plating method

Transactions of the Institute of Metal Finishing

Volumn 89, Issue 2, 2011, Pages 83-88

  Rajasekaran, N ^a   Mohan, S ^a  

^a CENTRAL ELECTROCHEMICAL RESEARCH INSTITUTE   (India)

Author keywords

Atomic force microscopy; Copper nickel alloy; Electrochemical impedance spectroscopy; Electrodeposited film

Indexed keywords

ALLOY DEPOSITS; BATH TEMPERATURES; BRUSH PLATING; COPPER-NICKEL ALLOY; CORROSION POTENTIALS; CORROSION STUDIES; CRYSTALLINE SIZE; CU-NI ALLOYS; DEPOSITION TEMPERATURES; ELECTRODEPOSITED FILM; HIGHER TEMPERATURES; MORPHOLOGY AND COMPOSITION; SMALL GRAIN SIZE; X RAY FLUORESCENCE ANALYSIS; X-RAY DIFFRACTION STUDIES;

ALLOYS; ATOMIC FORCE MICROSCOPY; ATOMIC SPECTROSCOPY; BRUSHES; CORROSION RESISTANCE; CRYSTALLINE MATERIALS; DEPOSITS; ELECTROCHEMICAL CORROSION; ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY; ELECTRODEPOSITION; FLUORESCENCE; MORPHOLOGY; NICKEL ALLOYS; STOICHIOMETRY; SURFACE MORPHOLOGY; X RAY DIFFRACTION;

COPPER ALLOYS;

EID: 79953748401     PISSN: 00202967     EISSN: None     Source Type: Journal    
DOI: 10.1179/174591911X12956245648983     Document Type: Article

References (22)

1. A. H. L. Chamberlain and B. J. Garner: Biofouling, 1988, 1, 79.
2. R. Ying: J. Electrochem. Soc., 1988, 135, 2957.
3. E. Padlaha, Ch. Bonhote and D. Landolt: Electrochim. Acta., 1994, 39, 2649.
4. Q. J. Xue and W. Zhang: J. Phys. D: Appl. Phys., 1997, 30, 3301.
5. F. El-Chiekh, M. T. El-Haty, H. Minoura and A. A. Montaser: Electrochim. Acta, 2005, 50, 2857.
6. R. E. Hummel and R. J. Smith: Corros. Sci., 1988, 28, 279.
7. J. A. Ali and J. R. Ambrose: Corros. Sci., 1991, 32, 799.
8. H. P. Hack and H. W. Pickering: J. Electrochem. Soc., 1991, 138, 690.
9. P. Druska and H.-H. Strehblow: Corros. Sci., 1996, 38, 1369.
10. J. M. Maciel and S. M. L. Agostinho: J. Appl. Electrochem., 2000, 30, 981.
11. R. S. Goncalves, D. S. Azambuja and A. M. S. Lucho: Corros. Sci., 2002, 44, 467.
12. K. M. Ismail, A. M. Fathi and W. A. Badawy: J. Appl. Electrochem., 2004, 34, 223.
13. M. R. F. Hartado, P. T. A. Sumodjo and A. V. Benedetti: Electrochim. Acta, 2003, 48, 2791.
14. W. A. Badway, K. M. Ismail and A. M. Fathi: Electrochim. Acta, 2005, 50, 3603.
15. Z. Zainal, A. Kassim, M. Z. Hussein and C. H. Ching: Mater. Lett., 2004, 58, 2199.
16. L. Du, B. Xu, S. Dong, H. Yang and Y. Wu: Surf. Coat. Technol., 2005, 192, 311.
17. B. Subramanian, S. Mohan, S. Jayakrishnan and M. Jayachandran: Curr. Appl. Phys., 2007, 7, 305.
18. B. Subramanian, S. Mohan, S. Jayakrishnan and M. Jayachandran: Surf. Coat. Technol., 2006, 201, 1145.
19. S. K. Ghosh, A. K. Grover, G. K. Dey and M. K. Totlani: Surf. Coat. Technol., 2000, 126, 48.
20. I. Baskaran, T. S. N. Shankaranarayanan and A. Stephen: Mater. Lett., 2006, 60, 1990.
21. M. Srivastava, V. Ezhil Selvi, V. K. William Gripss and K. S. Rajam: Surf. Coat. Technol., 2006, 201, 3051.
22. N. Rajasekaran and S. Mohan: J. Appl. Electrochem., 2009, 39, 1911.