Electrochemical assessment of Cu-PIII treated titanium samples for antimicrobial surfaces

Materials Science Forum

Volumn 706-709, Issue , 2012, Pages 478-483

  Finke, Birgit ^a   Polak, Martin ^a   Hempel, Frank ^a   Schroeder, Karsten ^a   Lukowski, Gerold ^b   Mueller, Wolf Dieter ^c   Weltmann, Klaus Dieter ^a  

^a LEIBNIZ INSTITUTE FOR PLASMA SCIENCE AND TECHNOLOGY   (Germany)

^b UNIVERSITY OF GREIFSWALD   (Germany)

^c CHARITÉ UNIVERSITÄTSMEDIZIN BERLIN   (Germany)

Author keywords

Antimicrobial; Electrochemical surface properties; Gas discharge plasma; Methicillin resistant Staphylococcus aureus (MRSA); Plasma Immersion Ion Implantation (PIII); Surface modification

Indexed keywords

BACTERIA; COPPER; COPPER COMPOUNDS; ION IMPLANTATION; METAL IONS; PLASMA APPLICATIONS; SODIUM CHLORIDE; SURFACE TREATMENT; TITANIUM;

ANTIMICROBIAL; ELECTROCHEMICAL SURFACE PROPERTIES; GAS-DISCHARGE PLASMAS; METHICILLIN-RESISTANT STAPHYLOCOCCUS AUREUS; PLASMA IMMERSION ION IMPLANTATION;

ELECTRIC DISCHARGES;

EID: 84856161667     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/MSF.706-709.478     Document Type: Conference Paper

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