A multiscale assembly and packaging system for manufacturing of complex micro-nano devices

IEEE Transactions on Automation Science and Engineering

Volumn 9, Issue 1, 2012, Pages 160-170

  Das, Aditya N ^a   Murthy, Rakesh ^a   Popa, Dan O ^a   Stephanou, Harry E ^a  

^a University of Texas at Arlington   (United States)

Author keywords

3D microassembly; Automation; Reconfigurable robots; Visual servoing

Indexed keywords

ASSEMBLY PROCESS; ASSEMBLY SYSTEMS; COST OF PRODUCTIONS; COST-EFFICIENT; ENABLING TECHNOLOGIES; FABRICATION PROCESS; FEEDBACK SYSTEMS; HIGH RESOLUTION CAMERA; IN-PLANE; MACRO SCALE; MANIPULATION SYSTEM; MANUFACTURABILITY; MICRO ASSEMBLY; MICRO DEVICES; MICRO GRIPPER; MICRO MANIPULATION; MICRO PART; MICRO-NANO; MICRO-SPECTROMETER; MICROMACHINING TECHNIQUES; MICROSCOPIC VISION; MULTISCALES; OFF-THE-SHELF COMPONENTS; OPTICAL SPECTRUM ANALYZER; PACKAGING SYSTEM; RE-CONFIGURABLE; RECONFIGURABLE ROBOT; SPECIFIC TASKS; STRUCTURAL RIGIDITY; SYSTEM SPECIFIC;

ACCELEROMETERS; ASSEMBLY; AUTOMATION; MACHINE DESIGN; MANUFACTURE; MICROMACHINING; PACKAGING MACHINES; SPECTRUM ANALYZERS; STEREO VISION; VISUAL SERVOING;

MICROSYSTEMS;

EID: 84855347440     PISSN: 15455955     EISSN: None     Source Type: Journal    
DOI: 10.1109/TASE.2011.2173570     Document Type: Article

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