On the mechanical properties of nanoporous anodized alumina by nanoindentation and sliding tests

Surface and Coatings Technology

Volumn 206, Issue 8-9, 2012, Pages 2115-2124

  Vojkuvka, L ^a   Santos, A ^a   Pallares J ^a   Ferre Borrull J ^a   Marsal, L F ^a   Celis, J P ^b  

^a UNIVERSITAT ROVIRA I VIRGILI   (Spain)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

Anodized aluminum; Elastic behavior; Image analysis; Nanoindentation; Plastic deformation; Scratch test

Indexed keywords

ACID ELECTROLYTES; ALUMINA STRUCTURE; ANODIZATION PROCESS; ANODIZED ALUMINA; ANODIZED ALUMINUM; APPLIED LOADS; COEFFICIENT OF FRICTIONS; ELASTIC BEHAVIOR; ELASTOPLASTIC BEHAVIOR; FEG-SEM; HIGH WATER CONTENT; NANO-POROUS; NANOPILLAR STRUCTURES; PHOSPHATE ANIONS; POROSITY LEVEL; SCRATCH TEST; SLIDING TEST; YOUNG'S MODULUS;

ALUMINUM; ELASTIC MODULI; ELASTICITY; IMAGE ANALYSIS; NANOINDENTATION; PHOSPHORIC ACID; PLASTIC DEFORMATION; SULFURIC ACID;

ALUMINA;

EID: 84855263255     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2011.09.040     Document Type: Article

References (30)

1. Masuda H., Fukuda K. Science 1995, 268:1466.
2. Al Mawlawi D., Coombs N., Moskovits M. J. Appl. Phys. 1991, 70:4421.
3. Haberkorn N., Gutmann J.S., Theato P. ACS Nano 2009, 3:1415.
4. Gorokh G., Mozalev A., Solovei D., Khatko V., Llobet E., Correig X. Electrochim. Acta 2006, 52:1771.
5. Holtz J.H., Asher S.A. Nature 1997, 389:829.
6. Deubel M., von Freymann G., Wegener M., Pereira S., Busch K., Soukoulis C.M. Nat. Mater. 2004, 3:444.
7. Sauer G., Brehm G., Schneider S., Nielsch K., Wehrspohn R.B., Choi J., Hofmeister H., Gösele U. J. Appl. Phys. 2002, 91:3243.
8. Santos A., Vojkuvka L., Pallarés J., Ferré-Borrull J., Marsal L.F. Nanoscale Research Letters 2009, 4:1021.
9. Matsumoto F., Harada M., Nishio K., Masuda H. Adv. Mater. 2005, 17:1609.
10. Bueno S., Baudin C. J. Mater. Res. 2006, 21:161.
11. Oliver W.C., Pharr G.M. J. Mater. Res. 1992, 7:1564.
12. Choi D., Kim S., Lee S., Kim D., Lee K., Park H., Hwang W. Nanotechnology 2008, 19:145708.
13. Choi D., Lee S., Kim S., Lee P., Lee K., Park H., Hwang W. Scr. Mater. 2008, 58:870.
14. Latella B.A. J. Mater. Sci. Lett. 2000, 19:1127.
15. Bhushan B., Sundararajan S. Acta Mater. 1998, 46:3793.
16. Xia Z., Riester L., Sheldon B.W., Curtin W.A., Liang J., Yin A., Xu J.M. Rev. Adv. Mater. Sci. 2004, 6:131.
17. Ko S., Lee D., Jee S., Park H., Lee K., Hwang W. Thin Solid Films 2006, 515:1932.
18. Fang T.H., Wang T.H., Liu C.H., Ji L.W., Kang S.H. Nanoscale Res. Lett. 2007, 2:410.
19. Jeon J.H., Hwang W., Lee K.H. J. Compos. Mater. 2009, 43:1155.
20. Ng K.Y., Lin Y., Ngan A.H.W. Acta Mater. 2009, 57:2710.
21. Zeng K., Chiu C.-H. Acta Mater. 2001, 49:3539.
22. Papka S.D., Kyriakides S. Int. J. Solids Struct. 1998, 35:239.
23. Papka S.D., Kyriakides S. Acta Mater. 1998, 46:2765.
24. Nanostructured Materials in Electrochemistry 2008, 1. WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim. A. Eftekhari (Ed.).
25. Thompson G.E., Wood G.C. Nature 1981, 290:230.
26. Nielsch K., Choi J., Schwirn K., Wehrspohn R.B., Gösele U. Nano Lett. 2002, 2:677.
27. Ono S., Ichinose H., Masuko N. J. Electrochem. Soc. 1991, 138:3705.
28. Ono S., Ichinose H., Masuko N. J. Electrochem. Soc. 1992, 139:L80.
29. Palibroda E., Marginean P. Thin Solid Films 1994, 240:73.
30. Lee W., Nielsch K., Gösele U. Nanotechnology 2007, 18:475713.