CMOS-compatible aligned fusion wafer bonding

Proceedings of the International Semiconductor Conference, CAS

Volumn 1, Issue , 2011, Pages 141-144

  Dragoi, V ^a   Mittendorfer, G ^a   Flotgen, C ^a   Dussault, D ^b   Wagenleitner, T ^a  

^a EV GROUP   (Austria)

^b PROSYS INC   (United States)

Author keywords

3D integration; back side illumination; CMOS image sensor; optical alignment; plasma activated wafer bonding; single wafer cleaning

Indexed keywords

3-D INTEGRATION; CMOS IMAGE SENSOR; OPTICAL ALIGNMENTS; PLASMA ACTIVATED WAFER BONDING; SINGLE-WAFER CLEANING;

CMOS INTEGRATED CIRCUITS; SILICON WAFERS; THREE DIMENSIONAL;

WAFER BONDING;

EID: 84255187397     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SMICND.2011.6095739     Document Type: Conference Paper

References (8)

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2. US patent 6,791, 242, 2004.
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