Interfaces features in polymer nanocomposites: A review of proposed models

Nano

Volumn 6, Issue 6, 2011, Pages 497-508

  Pitsa, Despoina ^a   Danikas, Michael G ^a  

^a DEMOCRITUS UNIVERSITY OF THRACE   (Greece)

Author keywords

dielectric properties; interfaces; layers; phenomena; Polymer nanocomposites

Indexed keywords

BASE POLYMERS; CONVENTIONAL POLYMERS; ELECTRICAL STRUCTURES; LAYERS; MICRON-SCALE PARTICLES; MULTI-CORE MODEL; PHENOMENA; POLYMER NANOCOMPOSITE; POLYMER NANOCOMPOSITES;

DIELECTRIC PROPERTIES; INTERFACES (MATERIALS); MODELS; NANOCOMPOSITES;

POLYMERS;

EID: 83755163049     PISSN: 17932920     EISSN: None     Source Type: Journal    
DOI: 10.1142/S1793292011002949     Document Type: Review

References (70)

1. M. F. Fréchette, A. Vijh, M. L. Trudeau, D. Fabiani, L. Utracki, S. Gubanski, A. Sami, E. David, J. Kindersberger,C. Laurent, C. Reed, P. Morshuis,T. Andritsch, R. Kochetov, A. Krivda, A. Vaughan, J. Fothergill, S. Dodd, J. Castellon, F. Guastavino and H. Alamdari, Nanodielectrics: A panacea for solving all electrical insulation problems? Proc. 2010 IEEE Int. Conf. Solid Dielectrics, Potsdam, Germany, 4-9 July 2010, pp. 130-158.
2. M. Takala, H. Ranta, J. Pelto, S. Virtanen, V. Koivu, M. Petterson and K. Kannus, Dielectric properties of polypropylene-silica nanocomposites, Proc. 21st Nordic Insulation Symp. NORD-1s 09, Gothenburg, Sweden, 15-17 June 2009, pp. 31-35.
3. T. Agag, T. Koga and T. Takeichi, Polymer 42, 3399 (2001).
4. S. Zhao, L. S. Schadler, H. Hillborg and T. Auletta, Effect of interfacial strength on mechanical properties of Al2O3/epoxy nanocomposites, Proc. 21st Nordic Insulation Symp. NORD-1s 09, Gothenburg, Sweden, 15-17 June, pp. 41-44.
5. T. J. Lewis, J. Phys. D: Appl. Phys. 38, 202 (2005).
6. J. K. Nelson, Overview of nanodielectrics: Insulating materials of the future, Proc. Int. Conf. Electrical Insulation and Electrical Manufacturing Expo, Toronto, 22-24 October 2007, pp. 229-235.
7. M. Roy, J. K. Nelson, R. K. MacCrone and L. S. Schadler, J. Mater. Sci. 42, 3789 (2007).
8. F. Ciuprina, I. Plesa, P. V. Notingher and T. Tudorache, Dielectric properties of nanodielectrics with inorganic fillers, Annual Report Conf. Electrical Insulation and Dielectric Phenomena, Quebec, Canada, 26-29 October 2008, pp. 682-685.
9. St. Raetzke, Y. Ohki, T. Imai, T. Tanaka and J. Kindersberger, IEEE Trans. Dielectr. Electr. Insul. 16, 1473 (2009).
10. L. A. Dissado and J. C. Fothergill, Electrical Degradation and Breakdown in Polymers (Peter Peregrinus Ltd., London, UK, 1992).
11. T. J. Lewis, IEEE Trans. Dielectr. Electr. Insul. 1, 812 (1994).
12. T. J. Lewis, Interfaces and nanodielectrics are synonymous, Proc. Int. Conf. Solid Dielectrics, 5-9 July 2004, pp. 792-795.
13. T. J. Lewis, IEEE Trans. Dielectr. Electr. Insul. 11, 739 (2004).
14. T. J. Lewis, A model for nano-composite dielectrics under electrical stress, Proc. Int. Conf. Solid Dielectrics, UK, 8-13 July 2007, pp. 11-14.
15. G. Tsagaropoulos and A. Eisenberg, Macromolecules 28, 6067 (1995).
16. T. Tanaka, M. Kozako, N. Fuse and Y. Ohki, IEEE Trans. Dielectr. Electr. Insul. 12, 669 (2005).
17. M. G. Danikas, J. Electr. Eng. 61, 241 (2010).
18. B. Pukanszky, Eur. Polym. J. 41, 645 (2005).
19. L. S. Schadler, L. C. Brinson and W. G. Sawyer, J. Mater. 59, 53 (2007).
20. M. Roy, J. K. Nelson, R. K. MacCrone, L. S. Schadler, C. W. Reed, R. Keefe and W. Zenger, IEEE Trans. Dielectr. Electr. Insul. 12, 629 (2005).
21. N. Fuse, M. Kozako, T. Tanaka, S. Murase and Y. Ohki, Possible mechanism of superior partialdischarge resistance of polyamide nanocomposites, Annual Report Conf. Electrical Insulation and Dielectric Phenomena, 17-20 October 2004, pp. 322-325. (Pubitemid 40574803)
22. T. Desai, P. Keblinski and S. Kumar, J. Chem. Phys. 122, 134910 (2005).
23. H. Lu and S. Nutt, Macromolecules 36, 4010 (2003).
24. T. D. Fornes and D. R. Paul, Polymer 44, 3945 (2003).
25. J. I. Hong, L. S. Schadler and R. W. Siegel, Appl. Phys. Lett. 82, 1956 (2003).
26. J. C. Fothergill, Ageing, space charge and nanodielectrics: Ten things we don't know about dielectrics, Proc. Int. Conf. Solid Dielectrics, UK, 8-13 July 2007, pp. 1-10.
27. J. K. Nelson and Y. Hu, The impact of nanocomposite formulations on electrical voltage endurance, Proc. Int. Conf. Solid Dielectrics ICSD'07, UK, 5-9 July 2004, pp. 832-835.
28. T. Tanaka, G. C.Montanari and R.Mulhaupt, IEEE Trans. Dielectr. Electr. Insul. 11, 763 (2004).
29. E. Fekete, S. Z. Molnar, G. M. Kim, G. H. Michler and B. Pukanszky, J. Macromol. Sci. Phys. B 38, 885 (1999).
30. T. Imai, F. Sawa, T. Ozaki, Y. Inoue, T. Shimizu and T. Tanaka, Roles of fillers on properties of nano- TiO2 and micro-SiO2 filler mixed composites, Proc. Int. Conf. Solid Dielectrics ICSD'07, UK, 8-13 July 2007, pp. 407-410.
31. C. L. Yin, Z. Y. Liu, W. Yang, J. M. Feng and M. B. Yang, Polym. Plast. Technol. Eng. 48, 788 (2009).
32. B. J. Ash, R. W. Siegel and L. S. Schadler, Macromolecules 37, 1358 (2004).
33. P. Barber, S. Balasubramanian, Y. Anguchamy, S. Gong, A. Wibowo, H. Gao, H. J. Ploehn and H.-C. zur Loye, Materials 2, 1697 (2009).
34. D. Ma, T. A. Hugener, R. W. Siegel, A. Christerson, E. Martensson, C. Onneby and L. S. Schadler, Nanotechnology 16, 724 (2005).
35. T. Imai, Y. Hirano, H. Hirai, S. Kojima and T. Shimizu, Preparation and properties of epoxyorganically modified layered silicate nanocomposites, IEEE Int. Symp. Electrical Insulation, Boston, 7-10 April 2002, pp. 379-383. (Pubitemid 34658524)
36. F. Hussain, J. Chen and M. Hojjati, Mater. Sci. Eng. A 445-446, 467 (2007).
37. S. Siddabattuni, T. P. Schuman and F. Dogan, Mater. Sci. Eng. B 176, 1422 (2011).
38. M. Z. Rong, M. Q. Zhang and W. H. Ruan, Mater. Sci. Technol. 22, 787 (2006).
39. J. K. Nelson, J. C. Fothergill, L. A. Dissado and W. Peasgood, Towards an understanding of nanometric dielectrics, Annual Report Conf. Electrical Insulation and Dielectric Phenomena, 20-24 October 2002, pp. 295-298. (Pubitemid 35406980)
40. R. C. Smith, C. Liang, M. Landry, J. K. Nelson and L. S. Schadler, IEEE Trans. Dielectr. Electr. Insul. 15, 187 (2008).
41. A. Schonhals, H. Goering, F. R. Costa, U. Wagenknecht and G. Heinrich, Macromolecules 42, 4165 (2009).
42. J. Yacubowicz, M. Narkis and L. Benguigui, Polym. Eng. Sci. 30, 459 (1990).
43. M. Pluta, J. K. Jeszka and G. Boiteux, Eur. Polym. J. 43, 2819 (2007).
44. J. K. Nelson and Y. Hu, J. Phys. D: Appl. Phys. 38, 213 (2005).
45. J. K. Nelson, Y. Hu and J. Thiticharwnpong, Electrical properties of TiO2 nanocomposites, Annual Report Conf. Electrical Insulation and Dielectric Phenomena, 19-22 October 2003, pp. 719-722.
46. Y. Cao and P. C. Irwin, The electrical conduction in polyimide nanocomposites, Annual Report Conf. Electrical Insulation and Dielectric Phenomena, USA, 19-22 October 2003, pp. 116-119.
47. St. Raetzke and J. Kindersberger, IEEJ Trans. FM 126, 1044 (2006).
48. J. K. Nelson, L. A. Utracki, R. K. MacCrone and C. W. Reed, Role of the interface in determining the dielectric properties of nanocomposites, Annual Report Conf. Electrical Insulation and Dielectric Phenomena, USA, 17-20 October 2004, pp. 314-317. (Pubitemid 40574801)
49. A. Eisenberg, B. Hird and R. B. Moore, Macromolecules 23, 4098 (1990).
50. B. J. Ash, L. S. Schadler and R. W. Siegel, Mater. Lett. 55, 83 (2002).
51. S. Singha and M. J. Thomas, IEEE Trans. Dielectr. Electr. Insul. 16, 531 (2009).
52. B. J. Ash, R.W. Siegel and L. S. Schadler, J. Polym. Sci. Part B Polym. Phys. 42, 4371 (2004).
53. J. S. Sharp and J. A. Forrest, Phys. Rev. Lett. 91, 235701 (2003).
54. Z. Yang, D. Peng, A. Clough, C.-H. Lam and O. K. C. Tsui, Eur. Phys. J. Spec. Top. 189, 155 (2010).
55. G. B. McKenna, Eur. Phys. J. Spec. Top. 189, 285 (2010).
56. A. Bansal, H. Yang, C. Li, K. Cho, B. Kilwon, C. Brian, S. Kumar and L. S. Schadler, Nat. Mater. 4, 693 (2005).
57. V. M. Boucher, D. Cangialosi, A. Alegría, J. Colmenero, I. Pastoriza-Santos and L. M. Liz- Marzan, Soft Mater. 7, 3607 (2011).
58. N. Mnif, V. Massardier, T. Kallel and B. Elleuch, Polym. Adv. Technol. 21, 896 (2009).
59. Q. Wang, G. Chen and A. S. Alghamdi, Influence of nanofillers on electrical characteristics of epoxy resins insulation, Proc. Int. Conf. Solid Dielectrics, Potsdam, 4-9 July 2010, pp. 263-266.
60. S. Gagliardi, V. Arrighi, R. Ferguson and M. T. F. Telling, Physica B 301, 110 (2001).
61. T. Tanaka, IEEE Trans. Dielectr. Electr. Insul. 12, 914 (2005).
62. T. Tanaka, A. Matsunawa, Y. Ohki, M. Kozako, M. Kohtoh and S. Okabe, IEEJ Trans. FM 126, 1128 (2006).
63. W. Bu, J. Yin, Y. Song, X. Liu, P. Yuani and F. Yong, Effect of nanometer inorganic particles on DC breakdown characteristics of Al2O3/PI films, Proc. Int. Conf. Properties and Applications of Dielectric Materials, Haibin, 19-23 July 2009, pp. 820-822.
64. S. Li, G. Yin, G. Chen, J. Li, S. Bai, L. Zhong, Y. Zhang and Q. Lei, IEEE Trans. Dielectr. Electr. Insul. 17, 1523 (2010).
65. C. Zou, J. C. Fothergill and S. W. Rowe, IEEE Trans. Dielectr. Electr. Insul. 15, 106 (2008).
66. S. W. Rowe, Electrical ageing of composites: An industrial perspective, Proc. Int. Conf. Solid Dielectrics, Winchester, UK, 8-13 July 2007, pp. 401-406.
67. D. Fabiani, G. C. Montanari and L. Testa, IEEE Trans. Dielectr. Electr. Insul. 17, 221 (2010).
68. S. Singha and M. J. Thomas, IEEE Trans. Dielectr. Electr. Insul. 15, 12 (2008).
69. P. Preetha andM. J. Thomas, IEEE Trans. Dielectr. Electr. Insul. 18, 264 (2011).
70. R. K. MacCrone, J. K. Nelson, R. C. Smith and L. S. Schadler, IEEE Trans. Dielectr. Electr. Insul. 15, 197 (2008).